Professional Service
Editorial board and organizing committees
- Editor-in-Chief, Computers, Materials & Continua, 2019-present
- Specialty Chief Editor, Frontiers in High Performance Computing: HPC Applications, 2022-present
- Guest Editor, MRS Communications, Special Issue on Artificial Intelligence, 2019
- Guest Editor, Integrating Materials and Manufacturing Innovation (IMMI), Special Issue on “Using Digital Data in Materials Science and Engineering”, 2013
- Editorial Oversight Committee Member, Integrating Materials and Manufacturing Innovation (IMMI), 2020-present
- Editorial Board, Integrating Materials and Manufacturing Innovation (IMMI), 2022-present
- Editorial Board, Scientific Reports, 2023-present
- Editorial Board, BMC/Springer Big Data Analytics, 2016-2020
- Organizing Committee Member, First Workshop on Machine Learning for Materials Science (MLMS) in conjunction with 28th ACM SIGKDD Conference on Knowledge Discovery and Data Mining, August 15, 2022
- Organizing Committee Member, Data & Analytics for Materials Research Summit, hosted by the National Institute of Standards and Technology and its Center of Excellence for Hierarchical Materials Design (CHiMaD), October 31 - November 2, 2016.
- Advisory Committee Member, Materials Data Analytics: A Path-Finding Workshop, hosted by ASM International’s CMD Network and OSU with support from NIST, October 8-9, 2015.
- Session Chair, TMS 2019, 2016
Invited program committee member
- IEEE International Conference on Data Mining (ICDM) 2024, 2023, 2022, 2021, 2020, 2019, 2018, 2017, 2016, 2015, 2014
- IEEE International Conference on Big Data (BigData) 2024, 2023, 2022, 2021, 2020, 2019, 2018, 2017, 2016, 2015, 2014, 2013
- ACM International Conference on Information and Knowledge Management (CIKM) 2022, 2021, 2020, 2019, 2013, 2012
- IEEE International Conference on Machine Learning and Applications (ICMLA) 2022, 2021
- ACM SIGKDD Conference on Knowledge Discovery and Data Mining (KDD) 2016
- IEEE International Conference on Machine Learning and Data Science (ICMLDS) 2017
- ACM/IEEE International Conference for High Performance Computing, Networking, Storage and Analysis (SC) 2017
- IEEE International Parallel & Distributed Processing Symposium (IPDPS) 2016, 2015
- IEEE IPDPS Workshop on Parallel and Distributed Processing for Computational Social Systems (ParSocial) 2022, 2021, 2020, 2018, 2017, 2016
- IEEE ICDM Workshop on Data Mining in Networks (DaMNet) 2019, 2017, 2016, 2015, 2014, 2013, 2012
- ACM/IEEE SC Workshop on Big Data Analytics: Challenges and Opportunities (BDAC) 2015
- IEEE International Conference on Systems, Man, Cybernetics (SMC) 2015
- IEEE International Conference on Big Data Science and Engineering (BDSE) 2014, 2013
Invited grant proposal reviewer/panelist
- US National Science Foundation (NSF)
- US Department of Energy (DOE)
- US Air Force Office of Scientific Research (AFOSR)
- US Army Research Office (ARO)
- Northwestern Data Science Initiative (DSI)
- Singapore Agency for Science, Technology and Research (A*STAR)
- European Research Council (ERC)
- Dutch Research Council (NWO)
- Austrian Science Fund (FWF)
- Mitacs Canada
Invited paper reviewer
- ACM Computing Surveys
- ACM Transactions on Knowledge Discovery from Data (TKDD)
- ACS Combinatorial Science
- ARC American Institute of Aeronautics and Astronautics Journal (AIAA)
- BMC Big Data Analytics
- BMC Bioinformatics
- BMC Medical Informatics and Decision Making
- BMC Research Notes
- Cambridge MRS Advances
- Cambridge MRS Communications
- Elsevier Acta Materialia
- Elsevier Additive Manufacturing (AM)
- Elsevier Calphad (Computer Coupling of Phase Diagrams and Thermochemistry)
- Elsevier Computers in Biology and Medicine (CBM)
- Elsevier Computer Methods and Programs in Biomedicine (CMPB)
- Elsevier Computer Communications (COMCOM)
- Elsevier Computational Materials Science (COMMAT)
- Elsevier Current Opinion in Solid State & Materials Science (COSSMS)
- Elsevier Composites Science and Technology (CSTE)
- Elsevier Data and Knowledge Engineering (DKE)
- Elsevier Digital Signal Processing (DSP)
- Elsevier Information Sciences
- Elsevier Journal of Computational Science (JOCS)
- Elsevier Journal of Parallel and Distributed Computing (JPDC)
- Elsevier Materials Science and Engineering: A (MSEA)
- Elsevier Neural Networks (NEUNET)
- Hindawi BioMed Research International
- Hindawi Scientifica
- IEEE Transactions on Computational Biology and Bioinformatics (TCBB)
- IEEE Transactions on Emerging Topics in Computing (TETC)
- IEEE Transactions on Knowledge and Data Engineering (TKDE)
- IEEE Transactions on Parallel and Distributed Systems (TPDS)
- IEEE Transactions on Very Large Scale Integration Systems (TVLSI)
- IET Healthcare Technology Letters
- Inderscience International Journal of Computer Aided Engineering and Technology (IJCAET)
- Inderscience International Journal of High Performance Computing and Networking (IJHPCN)
- MDPI Algorithms
- MDPI Crystals
- MDPI Entropy
- Nature Communications
- npj Computational Materials
- OxfordUP Bioinformatics
- PLOS One
- Springer Artificial Intelligence Review
- Springer Data Mining and Knowledge Discovery (DMKD)
- Springer Integrating Materials and Manufacturing Innovation (IMMI)
- Springer International Journal of Precision Engineering and Manufacturing (IJPEM)
- Springer Journal of Materials Science (JMSC)
- Springer Language Resources and Evaluation (LREV)
- T&F International Journal of Parallel, Emergent and Distributed Systems (IJPEDS)
- T&F Journal of Civil Engineering and Management (JCEM)
- T&F Transport
- Wiley Concurrency and Computation: Practice and Experience (CCPE)
- World Scientific Journal of Circuits, Systems, and Computers (JCSC)
- SC 2013
- ICDM 2012
- ICDM DaMNet 2011
- IPDPS 2011
- PAKDD 2010